Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information
Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information

Electronics X-Ray Inspection
XT V 130C

The XT V 160 is specifically designed for use in production lines and failure analysis laboratories. With a precision joystick, system users control the 5-axis sample manipulator. Real-time X-ray allows users to intuitively navigate complex printed circuit boards and electronic components and quickly trace defects. In automated inspection mode, samples can be inspected at highest throughput.

Key Benefits
  • Leading proprietary micro-focus source technology
  • Fast automated component inspection through customizable macros
  • Intuitive joystick navigation drives real-time X-ray imaging
  • 4K Ultra HD display for combined measurement and real-time analysis
  • Low cost of ownership and maintenance with open-tube technology
  • Safety as a design criterion
  • CT and X.Tract (laminography) ready
Specifications
  • Max kv: 160 kV
  • Power rating: 20 W (radiography), 10 W (CT)1
  • X-ray source: Open tube transmission target
  • Focal spot size: 1 µm1 (below 2 W) rising to 10 µm depending on power
  • Defect recognition capability: 500 nm
  • Geometric magnification: 2.5x -2,400x
  • System magnification: Up to 36,000x
  • Imaging system: (Standard) 1.45 Mpixel 12-bit camera with dual field 4"/6" image intensifier
  • Manipulator: 5-axis (X, Y, Z, T, R)
  • Rotate axis: Included
  • Tilt: 0 - 75 degrees
  • Measuring volume: Largest square in single map 406x406 mm (16x16")
  • Absolute max: 711x762 mm (28x30")
  • Max. sample weight: 5 kg (11 lbs)
  • Monitor: Single 4k IPS (3840x2160 pixels)
  • Cabinet dimensions (WxDxH): 1200 x 1786 x 1916 mm  (48.0x71.3x75.4")
  • Weight: 1.935 kg (4,266 lbs)
  • Radiation safety: <1μSv/hr at the cabinet surface
  • Automated inspection: Included
  • Computed Tomography: Optional CT and/or X.Tract
  • Primary applications: Real-time and automated electronics and semiconductor inspection, failure analysis (BGA, μBGA, flip-chip and loaded PCB boards)
Please contact us for more information