Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information
Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information

Elegrip Back Grinding Tape

Back grinding tape is used to protect the circuit surface from damage by foreign matter, chipping, cracking and contamination during back grinding process. With developments of jumbo-sized and thinned wafer and high bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer, and (3) easiness of peeling. Elegrip BG tape meets these requirements.​ ​​
Specifications
  • Taping: Excellent adhesion to uneven wafer surfaces
  • Cleanliness: Effective control of particles
  • Quality:
  •  - Excellent grinding accuracy (TTV)
  •  - Good water-seepage control
  • Detape: Easy Peeling
  • Strength: Effective control on adhesive deterioration with time
  • Applicable: Standard silicon wafer, middle bumped wafer
  • Color: Light blue (LB)
Please contact us for more information