Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information
Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information

Non-Contact Thickness Measurement System
MPT1000

The MPT1000 is Chapman Instruments’ latest non-contact system, providing wafer thickness measurements. It can be used as a production tool for in-line quality inspection, a research and development tool for establishing standards, and compiling data for enhancing productivity. The MPT1000 utilizes a sophisticated non-contact measurement technology with a focused laser spot on the wafer surfaces. Users can measure structured taped wafers after backgrind or dicing. The powerful, user-friendly, Windows® based operational software can be programmed to provide automated wafer thickness maps, execute a series of measurements, or report the data off-line for further analysis.

Key Features
  • Non-contact, providing non-destructive thickness measurements
  • 0.1 μm thickness resolution, providing thickness uniformity and Q/C control
  • 1 μm laser spot size on both top and bottom wafer surfaces, providing the ability to distinguish between small features, e.g. bump wafers
  • Optical Measurement System, providing accurate wafer thickness measurements independent of material properties, especially useful for patterned wafers, GaAs and other wafer types, after backgrind and dicing
  • Wafer Bow and Warp measurements
Specifications
  • Thickness resolution:  0.1µm
  • Repeatability:  0.1µm
  • Accuracy:  0.15µm
  • Range:  10µm to 10m
  • Wafer size:  up to 300 mm
Please contact us for more information