Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information
Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information

2nd Optical Inspection System 
DIS8000

DIS8000 designed to handle frame wafer after the wafer dicing process to process to inspect for the defect that is observable prior to dicing and also die defect resulted after dicing process. It's equipped with two type of defect identifications method namely inking on the defective die and a wafer map that contains the location of the defective die with classification. The system capable of performing wafer backside inspection.
Specifications
  • Wafer Size:  200mm and 300mm with frame/ring
  • Driven Mechanism:  Linear motor/Micro-stepping
  • XY Travel:  350(X) x 200(Y)mm
  • Z Travel:  40mm
  • Accuracy:  ±10µm
  • Resolution:  ±1µm
  • Wafer Map:  CREDEN SEMI G81 Standard
  • Optical Devices:  High power microscope with illuminator light source [ Wafer backside inspective (optional)]
Please contact us for more information