Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information
Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information

Wafer Tape Laminator
​EXL2-1200X

The Teikoku Tape Laminator provides two methods for cutting tapes to best match either blade cut or laser cut. Recipe controlled heat option provides tape application parameter settings for a wide variety of tape vendors. Vacuum lamination is available for NCF lamination. This works well on wafers with topography such as Flip Chip and TSV process wafer.

Features:
  • A tape laminator for wafers up to 300mm (optionally available: 8 inches)
  • Single and double cassette loading
  • Two cutting methods (V-notch cutting): digital cutter blade method and class 4 co2 laser method
  • All parameters important for taping can be controlled in the recipe
  • Can be used with thinner wafers (such as shaped or reworked wafers)
  • Other optional features are available
Specifications
  • Power: AC200 - 240V, Single Phase
  • Power Consumption: 3KVA
  • Clean Air Pressure (CDA): 0.5 - 0.6 MPa (Min Flow Rate: 120NL/min)
  • Vacuum: 650 - 750mHg (Min Flow Rate: 60NL/min)
  • Exhaust Duct Capacity: 5.03/min, 40mmH2O (100 diameter SUS Flange duct connection)
  • Dimension: 1350 x 1750 x 2100
  • Net weight: Approx 1200kg
Please contact us for more information