Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information
Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information

Wafer Tape Remover
EXR2-1200X

Teikoku De-taper is equipped with the capability to handle thin and warped wafer up to 10mm. The machine is good for high bump (300µm) wafer detaping with the special features:
  • Adjustable removing speed
  • Adjustable removing angle
  • Thin wafer handling
  • Inline UV Irradiation System

The UV tape removal feature provides Auto UV Intensity Calibration.

Features:
  • A tape remover for wafers of 300mm (optional available: 8 inches)
  • Single and double cassette loading
  • All parameters important for de-taping can be controlled in the recipe
  • Longer-lasting UV lamp realized by TTS's proprietary UV Technology
  • Other optional features are available
Specifications
  • Power: AC200 - 240V, Single Phase
  • Power Consumption: 2KVA (Without UV) 3KVA (With UV)
  • Clean Air Pressure (CDA): 0.5 - 0.6 MPa (Min Flow Rate: 120NL/min)
  • Vacuum: 650 - 750mHg (Min Flow Rate: 60NL/min)
  • Nitrogen (For UV): 0.2 - 0.4 Mpa (Min Flow Rate: 20NL/min
  • Exhaust Duct Capacity: 1.03/min, 10mmH2O (100 diameter SUS Flange duct connection)
  • Dimension: 1350 x 1750 x 1900
  • Net weight: Approx 800kg
Please contact us for more information