Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information
Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information
Assuring you our best, always

Post Wire Bond Inspection System
PWB1000V

High speed stereoscopic line-scanning 3D vision inspection system designed to meet the high throughput demand in semiconductor die-attach and wire bond inspection. Utilizing dual CCD line-scan camera system from Chromasens Germany, the integrated stereo optical assembly with factory pre-calibrated 3D algorithms ensuring consistent and accurate measurement at all time.
Specifications
  • Stereoscopic Line Scanning Camera system at 7300 pixel (Dual Sensor)
  • High-Speed 3D Image Reconstruction with 5700 line per second.
  • Fast Scanning Speed of 75mm per seconds. (max at line rate 20kHz)
  • 3D height map & colour image simultaneously.
  • High Brightness LED illuminator with patented reflection technology.
  • Cognex Based Image Processing System.
  • Parallel Processing with Multiples PCs.
  • Multiple Magazine Loader.
  • Dual Scanning Track Mechanism eliminates waiting time.
  • Defect Classification base on Vision Tools.
  • Strip Mapping, 2D Matrix Code, SESC-GEM & etc
Please contact us for more information