Auto-molding Machine ​GP-PRO SP-G Series

  • Designed to meet a wide range of needs for high quality, including connections to IoT devices, as well as resin sealing for consumer ICs, automotive ICs, and passive components through thorough dust protection.

Description

An automatic molding system suitable for mass production. The company has implemented dust protection to enhance reliability and meets a wide range of needs for high quality, from consumer ICs and passive components.

The lineup includes three models—the 80-ton, 120-ton and 170-ton—and are designed to meet a wide range of needs for high quality, including connections to IoT devices, as well as resin sealing for consumer ICs, automotive ICs, and passive components through thorough dust protection.

Dust protection to improve product quality – By installing a dedicated dust collection unit that encloses the parts feeder, dust generation has been reduced by 80% compared to a conventional one.

Providing the linear drive for the loader also solves dust risk and eliminates the risk of failure.

IoT ready for stable production – Real-time visibility into operation conditions required by smart factories is realized. (Optional)

Always-on monitoring provides alerts in advance to eliminate the risk of unexpected machine stoppages. We support customers’ predictive maintenance activities.

Dual-pot molds for larger products – In addition to conventional single-pot molds, the lineup includes dual-pot molds. They are compatible with large products that use large volumes of resin.

AI temperature prediction control technology improves mold temperature drop in real-time. (Patent pending)

Customizable (individual molds, heat sink molds) – Our automated technology allows customers to customize their equipment to meet their needs and product characteristics, enabling full-automatic production.

We offer a variety of solutions including molding machines with individual-piece alignment and molding machines with insert units, in order to support products such as ECU boards, passive components, power modules, and devices with heat sinks, which are different from the typical lead frame.

Wide range of standard equipment

  • Movable frame pre-heater
  • Image processing product differentiation
  • Powerful mold cleaner with rotating brush
  • Compatible with HD frames
  • A variety of molding options
  • HFC (bottom-mold movable CAV system)
  • VAM (vacuum-assisted molding)
  • PPG (Top gate system)
  • FAM (Film assisted system)

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