HiSOL Laser Decap Pro 2

  • Real-time observation with a 12Mega-Pixel CCD camera
  • Multiscanning directions of 90o and 45o to reduce unevenness
  • Lower maintenance cost of laser head (Laser diode replacement)
  • 2-years warranty

Description

Today, molding resins used for IC encapsulation are becoming robust. Conventional decapsulation techniques on such advanced IC packaging materials are becoming increasingly painstaking and challenging for failure analysis laboratories. Under such circumstances, the Laser Decap Pro 2 can effectively decap epoxy materials while keeping inner metal parts (i.e. wire bonding, pads) integrity intact. Ceramic type packaging (non-white/translucent) can also be processed from the bottom part (a compliment to OBIRCH analysis).

KEY BENEFIT:

  • Real-time observation with a 12Mega-Pixel CCD camera
  • Multiscanning directions of 90o and 45o to reduce unevenness
  • Lower maintenance cost of laser head (Laser diode replacement)
  • 2-years warranty
  • QR code and other permanent pattern markings on the product
  • Fast decapsulation process without damaging metal
  • Taking out mounted components on PCB board
  • Class 1 laser safety including door interlocks during operation + CE certificates

Specifications

Model

Laser Decap Pro 2

Product manufacturer

Japan

Laser, wavelength (nm)

Fiber, 1060nm

Field of view (mm x mm)

60 x 60

Processing area size (mm x mm)

120 x 120

Operation power (Watt)

400 (max)

Pulse Width (nano-seconds)

4 -200

Output

>18W

Pulse frequency (Hz)

1.6 – 1000k (continuous wave)

Optional

·         Dust collector (with deodorizing function) (with deodorizing function)

·         Sample holding jigs

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