RoHS & ELV Analyser – EA6000VX


  • The EA6000VX High-Sensitivity XRF Analyzer is capable of determining hazardous substances over entire surfaces as well as measuring microscopic points in a specified area; tasks that are not possible using conventional XRF instruments.


High-speed Mapping – The high count rate detector (max. 150,000 cps) and the large stage that scans a max. 250 mm × 200 mm area provides the high-speed mapping. For example, when mapping a 100 mm × 100 mm area, the EA6000VX can detect and specify the location of lead contained in the terminal of a mounting board in just a few minutes.

High Count Rate Detector with No LN2 Required – Equipped with the world-leading high count rate detector (a count rate 15 times higher compared with conventional models), the EA6000VX greatly improves measurement efficiency. Additionally, the detector does not require LN2, resulting in safer operation and higher up-time.

Continuous multi-point Measurements – With an auto-sampler, up to 500 points can be specified and continuously measured. Thus, measuring large samples can be performed with high throughput and minimal user intervention.

High Precision Overlap Function – The EA6000VX is capable of coating thickness measurements typically performed with the FT series, including the challenging measurement of ultra-thin Au film coatings. Analysis of hazardous substances such as Pb in plating can be determined simultaneously with coating thickness measurement. Some applications include the measurement of hazardous substance concentration in Pb-free solder plating, Sn plating of lead frames, and electroless Ni plating.

Microscopic Area Coating Thickness Measurements – The EA6000VX is capable of coating thickness measurements typical of the FT series including coating thickness measurement of ultrathin Au films. Analysis of hazardous substances such as Pb in plating can be measured simultaneously with coating thickness measurements. For example, possibilities include composition measurement of hazardous substances in Pb-free solder plating, Sn plating of lead frames, and electroless Ni plating.

RoHS Inspection – Effectively measures RoHS restricted substances contained in resin and metals with high sensitivity. You can specify areas to measure even with on complex sample geometries.

Light Element Measurement – The He Purge option enables the analysis of light elements starting with Na. The system purges with He only while making measurements, providing stable, cost-effective analysis.

See-through Mapping Function – Mapping images of various elements, such as Pb on boards, can be obtained without taking apart products or even knowing anything about the internal structure of laptop computers and cell phones, for example. By comparing the element mapping images obtained by penetrating X-rays, a great deal of information can be obtained about the structure and internal components.

Contaminant Analysis – With its high-speed mapping function, the EA6000VX is able to detect and locate small metal contaminants in the tens of micrometers size range for a wide measurement area (at a maximum of 250 mm × 200 mm). A small or minute amount of contaminant contained in organic substances including resin can be also detected.

Technologically Enhanced Operability -Auto Approach and Sample Collision Prevention Mechanism – Auto Approach Function measures the sample height and automatically adjusts the distance between sample and detector so that operator can easily measure samples with complicated shapes. In the case of manual operation, Sample Collision Prevention Mechanism prevents sample damages.

Key Features

  • Best suited for inspections for compliance to RoHS, ELV and China RoHS , and safety inspection of toys and kitchenware.
  • capable of non-destructive and quick analysis are now widely used to inspect the content of substances restricted by environmental directives represented by RoHS, ELV and China RoHS.
  • No Liquid Nitrogen (LN2) Required
  • Short Measurement Time


  • Elements – Atomic nos. 12 (Mg) to 92 (U) *Atomic nos. when using helium purge 11 (Na) to 92 (U)
  • Sample state – Solid / Powder / Liquid
  • X-ray irradiation direction – Top-down Irradiation
  • Detector – Vortex® (SDD) *No liquid nitrogen required
  • Analysis Area – Square 0.2 mm, 0.5 mm, 1.2 mm, 3 mm Electric switching
  • Sample imaging – High resolution CCD camera, 2 system

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