Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information
Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information
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  Wafer Thickness & Roughness Measuring System
MPT 1000  

The MPT1000 is Chapman Instruments’ latest non-contact system, providing wafer thickness measurements. It can be used as a production tool for in-line quality inspection, a research and development tool for establishing standards, and compiling data for enhancing productivity. The MPT1000 utilizes a sophisticated non-contact measurement technology with a focused laser spot on the wafer surfaces. Users can measure structured taped wafers after backgrind or dicing. The powerful, user-friendly, Windows® based operational software can be programmed to provide automated wafer thickness maps, execute a series of measurements, or report the data off-line for further analysis.
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