INDUSTRY
Semiconductor FEOL and BEOL Inspection Systems
QES delivers a complete portfolio of inspection, metrology, analysis, and handling equipment supporting both FEOL (Front-End of Line) and BEOL (Back-End of Line) semiconductor manufacturing. From wafer surface analysis and geometry measurement to packaging inspection and automated handling, our solutions help fabs, OSATs, and R&D labs improve yield, reduce process variation, and ensure product reliability.
FEOL (Front-End of Line) Solutions
In FEOL, process engineers face challenges such as film uniformity, contamination, wafer warpage, and plasma stability that directly impact yield. Our tools address these gaps by enabling precise measurement, monitoring, and defect detection at critical steps.
Key Products for FEOL:
3D Surface Profilers & Industrial Microscopes → measure film thickness, roughness, and detect micro-defects.
Surface Analysis Tools & Semiconductor Elemental Analysis → identify contamination sources and verify material composition.
Wafer Geometry Gauges, Thickness & Roughness Measurement Systems → ensure flatness and uniformity in wafers.
Plasma Cleaning & Etching Systems → stabilize plasma processes and improve surface adhesion.
Probe Stations, Wafer Probers & Probe Cards → enable precise electrical testing at wafer level.
Advanced Metrology Systems → provide high-resolution characterization for R&D and process control.
📌 How we fill FEOL gaps: QES systems allow fabs to monitor wafer quality in real-time, detect contamination before lithography, and maintain tight control over plasma and thin-film processes.
BEOL (Back-End of Line) Solutions
BEOL production introduces different challenges such as die attach accuracy, wire bond reliability, delamination, and packaging defects. Automated handling is also critical to maintain throughput without compromising wafer integrity.
Key Products for BEOL:
Die Sorters & Die Bonders → high-speed, high-accuracy die placement.
Semiconductor Molding Machines → ensure robust encapsulation and minimize voids.
Post-Process Inspection Systems → including post die attach, wire bond, mold, and probing inspection to detect cracks, delamination, or bond lift.
Optical & Automated Optical Inspection (AOI) Systems → identify die cracks, voids, and surface anomalies.
Scanning Acoustic Microscopes (SAM) → detect internal voids and delamination in molded packages.
Real-Time X-Ray & CT Inspection → identify voids and solder defects in 3D packaging.
XRF Coating Thickness Gauges & RoHS Compliance Analysis → ensure coating thickness control and regulatory compliance.
Automated Handling Equipment → including wafer sorting, packing/unpacking, and batch transfer systems.
📌 How we fill BEOL gaps: QES inspection and handling solutions reduce defect escape, improve package reliability, and ensure efficient wafer logistics from assembly to final test.
End-to-End Value
By integrating FEOL and BEOL solutions, QES supports the entire semiconductor manufacturing flow — helping customers improve process stability, accelerate problem detection, and achieve higher yields.
