Internal Training Session: Technical Knowledge Exchange on Advanced Packaging

We recently conducted an internal technical training session focused on Wafer Level and Panel Level Advanced Packaging, led by Dr. Eu and Simon Huang from NXP.

This session served as a valuable platform for our employees to deepen their understanding of emerging trends in advanced packaging technologies. The exchange of technical insights with industry experts reflects our ongoing commitment to continuous learning and staying ahead in semiconductor innovation.

We thank Dr. Eu and Simon Huang for sharing their expertise and contributing to this collaborative learning experience.