Bonding Tester – PTR 1101

  • PTR1102 BONDING TESTER is simple and robust equipment for using wire pull test and die share test.

Description

Key Benefits

  • Au, Al, Cu wire bonding of tension, shear, peel test
  • Chip parts, Gull Wing Lead solder joint strength test
  • BGA BALL melting, non-melting bonding strength test
  • MEMS shear strength testing in HDI

Specs & Applications

Load range

  • Pull test 20gFS~20kgFS
  • Push test 20gFS~20kgFS
  • Peel test 100gFS~20kgFS
  • Shear test 100gFS~100kgFS
  • Accuracy ±0.2%FS
 

Measuring speed range

  • Push test 0.001~5mm/sec
  • Shear test 0.001~10mm/sec
 

Driving range

  • X axis ±50mm
  • Y axis ±50mm
  • Z axis Max70mm
 

Size and Weight W485×D651×H725mm(75kg)

Power supply AC100V

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