Bonding Tester – PTR 1101

  • PTR1102 BONDING TESTER is simple and robust equipment for using wire pull test and die share test.


Key Benefits

  • Au, Al, Cu wire bonding of tension, shear, peel test
  • Chip parts, Gull Wing Lead solder joint strength test
  • BGA BALL melting, non-melting bonding strength test
  • MEMS shear strength testing in HDI

Specs & Applications

Load range

  • Pull test 20gFS~20kgFS
  • Push test 20gFS~20kgFS
  • Peel test 100gFS~20kgFS
  • Shear test 100gFS~100kgFS
  • Accuracy ±0.2%FS

Measuring speed range

  • Push test 0.001~5mm/sec
  • Shear test 0.001~10mm/sec

Driving range

  • X axis ±50mm
  • Y axis ±50mm
  • Z axis Max70mm

Size and Weight W485×D651×H725mm(75kg)

Power supply AC100V

You may also like…

Work with the best integrated solution provider

About Company

Subscribe Newsletter

2021 @ QES GROUP OF COMPANIES (201401042911)