Electronics X-ray Inspection – XT V 160

  • Proprietary 160 kV source with submicron focal spot size
  • True 72° tilting angle for optimum inspection of BGAs
  • Fast data capture and high-quality imaging
  • Large tray for loading multiple boards
  • Customizable macros automate measurement workflow
  • Remote validation station available


The XT V system range comprises world-class X-ray and CT inspection systems of advanced, ergonomic design, meeting today’s need for high-performance inspection of increasingly complex components with ever-tighter tolerances.

The systems are intuitive to use and harness industry-leading software to maximize productivity for all operators, with minimal need for training. Automated inspection modes allow inspection of samples at high throughput rates, with intuitive pass / fail reporting.

With sub-micron feature recognition, XT V inspection systems are applicable to a wide range of applications and industries including PCB assembly, BGA inspection, chip design, medical and automotive component manufacturing, aerospace, consumer products and much more.

The XT V series includes the patented Nikon Xi Nanotech X-ray source paired with industry-leading flat panel detectors to produce best-in-class image quality, along with seamless transition between radiography, 3D tomography and 3D laminography in one system.

Superior Inspection System – The patented Nikon Xi Nanotech X-ray source is of open-tube design, allowing an unlimited lifecycle and avoiding expensive replacements associated with sealed tubes. The X-ray source has a unique, integrated generator design, avoiding high-voltage cable maintenance and offering unlimited power and low cost of ownership. User-replaceable filament assemblies simply click into place and intuitive software performs automated filament alignment calibration for easy system up-keep and consistent image quality, year after year.

The XT V systems feature 160 kV maximum energy, 20W true-target power, over 2000x geometric magnification, and sub-micron defect recognition. The XT V inspection systems house sample sizes up to 711mmx762mm (28×30″) and a maximum sample weight of 5kg, with detector options allowing large detection areas (25cmx20cm) and efficient imaging up to 56fps.

Maximum productivity in minimum inspection time – True concentric imaging is a unique feature that comes as standard with the XT V series, allowing any region of interest (ROI) to remain in view with any combination of rotation, tilt and magnification, thanks to intelligent software and hardware.

Extreme oblique angle views up to 90° through the sample are easily achieved at any 360° sample rotation, making the inspection of complex and multi-layer assemblies a simple task for any user. The intelligent, 5-axis, programmable stage has a strong carbon fibre tray with collision-free sample manipulation, even at maximum magnification. The intuitive X-ray source and detector motion are controlled through joystick navigation for seamless real-time X-ray imaging.

Advanced intuitive software – Industry-leading Inspect-X software is supplied as standard with the XT V series. Nikon’s C.Clear imaging engine intelligently adapts to changing X-ray conditions and sample positions, automatically adjusting image controls, contrast and brightness to provide the clearest, sharpest images. Quick-access toolbars are available for next-generation defect analysis, with dedicated tools for sample measurement and analysis modules for PCB assemblies.

Inspect-X allows inspection in automation mode to maximize productivity; with automated reporting in a format that can be opened on any PC, an intuitive graphical interface to configure the inspection, pass/fail optimization and optional visual checks during automated inspection routines. 3D inspection is performed with CT and X.Tract laminography to allow digital slicing in any orientation for a full understanding of 3D component geometry.


  • Solder reflow analysis
  • BGA connectivity and analysis
  • Solder void calculation
  • Through-hole measurement and inspection
  • Die attach voiding measurement
  • Ball bond analysis
  • Stitch bond analysis
  • Micro BGA / chip-on-chip analysis
  • Pad array analysis
  • Dry joint detection and analysis


  • Flexibility combined in one system
  • Interactive visualization
  • Fully automatic X-ray inspection
  • Optional CT for in-depth analysis
  • Maximum magnification at unrivalled angles (up to 72°)
  • Fast operation with intuitive GUI and interactive joystick navigation
  • Low-cost maintenance with open-tube technology
  • Safe system requiring no special precautions or badges
  • Small footprint

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