Fan-out GB-20S

  • It pre-arranges the die on the bonding head before performing the entire group bonding process, achieving high-speed die bonding performance on large substrates.

Description

GB-20S is a panel-level high-speed die bonder that operates on the principle of batch die bonding. It pre-arranges the die on the bonding head before performing the entire group bonding process, achieving high-speed die bonding performance on large substrates. It can operate on substrates pre-coated with adhesive material, solder paste, flux, or double-sided adhesive film. The die tape frame can automatically load and unload, while the substrate requires manual loading and unloading.

  • Adopts the operation mode of pre-arranging and then bonding the entire group of dies, meeting the high production capacity requirements on large substrates.
  • The bonding compression time is relatively sufficient compared to single die operations, which can improve adhesive reliability.
  • The main spindle adopts linear motor drive to maintain long-term accuracy in picking and placing.
  • Immediate confirmation of picking status after picking to eliminate potential subsequent damage caused by picking errors.
  • Immediate inspection of placement results after pre-arrangement.
  • Flip and non-flip dual-use.

Product Specifications

  • Wafer Size: 12” on standard DISCO frame. Optional: 8” on standard DISCO frame.
  • Chip Size: 1.0 x 1.0mm ~ 7.0 x 7.0mm, T = 0.1 ~ 1.0mm.
  • Substrate: 600mm x 600mm, 300mm x 300mm, Ø300mm (optional module). Requires pre-coating with adhesive material or application of double-sided adhesive film.
  • Bonding Tool: Bonding head sized 40 x 40mm ~ 80 x 80mm. Custom-designed tool shape.
  • Bonding Accuracy: X/Y: ≤±10μm, θ ≤0.1° @ 3σ, chip size 1.0 x 1.0mm.
  • Throughput: Flip chip operation: 10kUPH @ chip size 1.0 x 1.0mm. Non-flip operation: 10kUPH @ chip size 1.0 x 1.0mm.
  • Bonding Force: Bonding head downward force: 0.5N ~ 200N. Bonding head area: 40 x 40mm ~ 80 x 80mm. Bonding head downward force programmable, with real-time monitoring.
  • Secondary Press Force: Press head downward force: 0.5N ~ 200N. Press head area: Capable of applying pressure to a row of dies within the matrix. Press head downward force programmable, with real-time monitoring.
  • Substrate Heating: Maximum 150°C, accuracy ≤±5°C.

Work with the best integrated solution provider

2024 @ QES GROUP BERHAD (201401042911)