Description
GB-40 is a batch die bonder with a multi-to-one architecture, designed to achieve high-speed die bonding performance on large substrates using the principle of batch die bonding. It employs multiple pre-alignment machines corresponding to the bonding machine structure, equipped with multiple sets of pre-alignment systems to significantly increase throughput and enable the bonding of multiple types of dies in a single operation. It can operate on substrates pre-coated with adhesive material, solder paste, flux, or covered with double-sided adhesive film.
The GB-40 is ideal for high-speed die bonding on large substrates, particularly in scenarios where batch processing and high throughput are critical. Its ability to handle various substrate types and bonding materials makes it suitable for a wide range of applications, from consumer electronics to industrial components.
Multi-to-One Architecture: The GB-40 employs a multi-to-one architecture, using multiple pre-alignment machines corresponding to the bonding machine structure. This setup significantly increases throughput and enables the bonding of multiple types of dies in a single operation.
Versatile Substrate Compatibility: It can operate on substrates pre-coated with adhesive material, solder paste, flux, or covered with double-sided adhesive film, providing flexibility for various bonding requirements.
Flip-Chip and Non-Flip Dual-Use: The machine supports both Flip-chip (face-down) and non-Flip (face-up) operations, adding to its versatility.
Parallel Configuration: Can be configured in parallel with multiple sets, enabling cross-group support to maximize application flexibility and resilience.
Flexible Production Scenarios: Freely configurable for single-wafer production of single-die products, multi-wafer production of single-die products, multi-wafer production of multi-die products, and other combinations.
Flexible Scheduling: Allows flexible scheduling of one or multiple cassette modules, pre-alignment modules, and fault occurrences.
Linear Motor Drive: The main spindle adopts a linear motor drive to maintain long-term high precision, high speed, low dust generation, and easy maintenance.
Internal Movement Systems: The pre-alignment block transfer system and wafer frame transport system move internally, minimizing the probability of collisions with personnel.
Optimized Throughput: Increased pre-alignment speed, shortened total equipment length, reasonable spatial configuration, and optimized throughput per unit area.
Calibration Auxiliary Functions: Multiple calibration auxiliary functions assist in quickly completing equipment setup tasks.
Product Specifications
- Wafer Size: 12” on standard DISCO frame (8” optional).
- Chip Size: 0.5 x 0.5mm ~ 7.0 x 7.0mm, T = 0.1 ~ 0.7mm.
- Substrate: 620mm x 620mm, 330mm x 330mm, Ø300mm, maximum bonding area: 600 x 600 mm, substrate pre-coated with adhesive material or covered with double-sided adhesive film.
- Bonding Tool: 40 x 40mm ~ 80 x 80mm batch die bonder head. Custom-designed tool shape.
- Bonding Accuracy: X/Y: ≤±10μm/300mm, θ ≤0.1° @ 3σ.
- Throughput: 6 kUPH/m² @ chip size 3 x 3 mm (Flip and Non-flip operations are the same).
- Bonding Force: Maximum 60kgf, programmable setting.