Fan-out ST-663

A precision machine designed to retrieve, sort, and arrange individual grains on a pre-coated substrate. Utilizing mapping data and alignment marks, it ensures accurate and organized placement for high-precision applications.

Description

The purpose of the ST-663 is to retrieve individual grains adhered to a film based on mapping data, sort them into designated bins, and neatly arrange them on the surface of a substrate. The substrate needs to be pre-coated with adhesive film, and the placement of grains must have alignment marks.

  • Patented Wafer & Substrate vertical working position to reduce dust contamination.
  • Ultra-short arm PP Arm to reduce mechanical vibration, improving stability in productivity and alignment accuracy.
  • Adoption of a non-protruding film picking method to reduce impact force on the chips and minimize chip damage.
  • After retrieving the chip, it is then positioned, and alignment with the alignment marks on the substrate is performed. The placement accuracy is ≤ ±10μm, and the angle accuracy is ≤ ±1° (3 sigma), with chip sizes ranging from 0.25mm to 1.2mm, under the condition of enabling the bin table θ angle compensation function (ensuring chip cutting appearance integrity).
  • The system also includes Pick Die abnormal CCD image identification inspection and position compensation.
  • With a 4 Heads Index structure, the Cycle Time is 175ms (for chip sizes between 0.25mm and 1.2mm), under the condition of the bin table θ not rotating.

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