Fan-out ST-812R

A high-speed machine for arranging semiconductor wafers on adhesive substrates. Featuring versatile feeding mechanisms, high precision, and easy maintenance, it ensures efficient and accurate wafer placement for semiconductor manufacturing

Description

ST-812R is a machine that can arrange cut semiconductor wafers on a film or adhesive substrate as required. It has the ability to achieve high speed and precision in picking and placing, and can retrieve and place the wafer on the film according to wafer mapping data. The wafer feeding mechanism can be used with a tape frame for 8″ frame production, while the bin feeding mechanism, equipped with a change kit and a large-area vacuum flat system, can be used for 320mm x 324mm frame or substrate production.

The ST-812R is ideal for high-speed and precise arrangement of semiconductor wafers on adhesive substrates. Its versatile feeding mechanisms and high productivity make it suitable for various semiconductor manufacturing processes, ensuring stability and precision in wafer placement.

  • High productivity, precision, and stability:
  • Disco 8″ frame on the wafer end
  • Automatic loading and unloading on the wafer end
  • Maximum square placement range on the bin end: 290mm x 290mm, compatible with both frame and substrate
  • Bin end equipped with a large vacuum flat suction system, adjustable flatness, and continues to function even during power failure to ensure uninterrupted operation
  • Vertical frame design minimizes dust contamination and shortens pick-and-place distance
  • Easy replacement of nozzles, top pins, and caps
  • Simple structure for easy maintenance.
Product Specifications:
  • Wafer Size: Compatible with Disco 8″ frame.
  • Maximum Placement Range: 290mm x 290mm on the bin end, compatible with both frame and substrate.
  • Bin Feeding Mechanism: Equipped with a change kit and a large-area vacuum flat system for 320mm x 324mm frame or substrate production.
  • Automatic Loading and Unloading: On the wafer end.
  • Vacuum Flat Suction System: Adjustable flatness, continues to function during power failure.
  • Vertical Frame Design: Minimizes dust contamination and shortens pick-and-place distance.

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