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Fully-Automatic Wafer Tape Laminator – 300mm

  • A tape laminator for wafers up to 300mm(optionally available:8inches)
  • Single and double cassette loading
  • Two cutting methods (V-notch cutting): digital cutter blade method and class 4 CO2 laser method.
  • All parameters important for taping can be controlled in the recipe.
  • Can be used with thinner wafers.(such as shaped or reworked wafers)
  • Other optional features are available.
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Description

SPECIFICATIONS

PowerAC200-240V,Single Phase
Power Consumption3KVA
Clean Air Pressure(CDA)0.5 – 0.6 MPa( Min Flow Rate:120NL/min)
Vacuum650 – 750mmHg( Min Flow Rate:60NL/min)
Exhaust Duct Capacity5.0m3/min,40mmH20(100mm diameter SUS Flange duct connection)

 

System Arrangement

Dimension(WxDxHmm)1350×1750×2100
Net WeightAppx 1200Kg

Technology & Expertise Focus

✅ Cutting-Edge Precision: Industry-leading testing and measurement tools with advanced metrology and automation solutions.
✅ Comprehensive Equipment Range: From non-destructive testing (NDT) tools to automated optical inspection (AOI) systems, we cover all your needs.
✅ Industry Trusted: Serving top manufacturers in semiconductor, automotive, metal, and electronics industries.
✅ Global Support & Service: With a dedicated team of experts, we provide end-to-end testing solutions across multiple regions.
Contact us today for a consultation