Hybrid Bonding DB-22H Ultra

  • DB-22H Ultra is a die bonder machine designed for advanced C2W-WLP (Chip to Wafer-Wafer Level Packaging) processes.

Description

DB-22H Ultra is a die bonder machine designed for advanced C2W-WLP (Chip to Wafer-Wafer Level Packaging) processes. It features dual gantries and dual bonding heads operating simultaneously to achieve high throughput rates. It supports both Flip and non-Flip functions and employs low-contact input carriers to enhance die bonding yield.

The DB-22H Ultra is ideal for advanced semiconductor packaging, particularly in scenarios where high precision and throughput are critical. Its ability to handle both Flip and non-Flip processes makes it suitable for a wide range of applications, from consumer electronics to high-performance computing.

Product Specifications:

  • Accuracy/UPH: ±0.2μm, Up to 2K
    • This indicates the machine’s precision and its ability to handle up to 2,000 units per hour.
  • Bonding Force: 0.5 – 30N
    • The bonding force range allows for delicate to more robust bonding requirements.
  • Die Size: 5-30mm
    • It can handle a variety of die sizes, making it versatile for different applications.
  • Die Thickness: 50-300μm
    • The machine can accommodate dies of varying thicknesses, adding to its flexibility.
  • Input: 12” Frame, Tray
    • The input mechanism supports 12-inch frames and trays, which are standard in the industry.
  • Output Size: 12” Wafer
    • The output is designed for 12-inch wafers, aligning with common semiconductor manufacturing standards.

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