Post Wire Bond Inspection System – PWB500V

Inspection systems ensuring high-quality wire bonding in semiconductor manufacturing.

Description

PWB1500V is designed to inspect and quality check on lead frame and substrate after the die attach and wire bond process. The system comes with a high-speed camera with a global shutter with 2D vision inspection platform. It equipped with a stroboscopic controller that synchronizes with an encoder and camera. It is using the on-the-fly scanning method with stroboscopic control that able to eliminate the waiting time of the inspection process.

Specifications
  • Programmable XY Stage for flexible Scanning
  • Programmable Adaptable Magazine Elevator and Motorized Loader
  • High Resolution Camera Up to 5.0MP with 2D Vision System Capability
  • Dual Magazine Loader with One Input & One Output
  • Defect Classification based on 4 Vision Tools
  • User-Friendly Software Control for Recipe Setup and Strip Mapping Capability
  • Various type of Reject Module such as Puncher Module, Wire Breaker Module, Laser Module, and etc (Selectable for One Type Only)
  • TCP-IP & RS232 Data Interface/SECS/GEM Data Communication (Optional)

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