Post Wire Bond Inspection System – PWB1500V

Description

PWB1500V is designed to inspect and quality check on lead frame and substrate after the die attach and wire bond process. The system comes with a high-speed camera with a global shutter with 2D vision inspection platform. It equipped with a stroboscopic controller that synchronizes with an encoder and camera. It is using the on-the-fly scanning method with stroboscopic control that able to eliminate the waiting time of the inspection process.

Specifications
  • Programmable XY Stage for flexible Scanning
  • Programmable Adaptable Magazine Elevator and Motorized Loader
  • High Resolution Camera Up to 5.0MP with 2D Vision System Capability
  • Dual Magazine Loader with One Input & One Output
  • Defect Classification based on 4 Vision Tools
  • User-Friendly Software Control for Recipe Setup and Strip Mapping Capability
  • Various type of Reject Module such as Puncher Module, Wire Breaker Module, Laser Module, and etc (Selectable for One Type Only)
  • TCP-IP & RS232 Data Interface/SECS/GEM Data Communication (Optional)

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