2nd Optical Inspection System – DIS8000


DIS8000 is mainly designed to handle the frame wafer after the wafer dicing process. The system is able to handle the 8” wafer size with frame/ring and 12” wafer size with frame/ring. Inspection of the wafer is conducted after the wafer dicing process to inspect for that is prior to dicing and also die defect resulted after dicing process. In general, most of the incoming wafers come with two of defect identification method; inker system on the defective die and wafer mapping system that contain the location of with classification.
  • Single Wafer Autoloader for 200 and 300mm Wafer Size
  • One Load Port for Standard Open Cassette
  • High Power Microscope with Five Objectives (In the Range of 2.5x to 50x)
  • Motorized Stage for XY Movements
  • Decoding on Customer Wafer Map to QMC Mapping System
  • Image Capturing System
  • User-Defined Reject Code & Summary Lot Report after Inspection
  • Built-in Barcode Scanner for Wafer Map Download/Upload Process from Server

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