Description
DIS8000 is designed for 2nd Optical Inspection, which is usually conducted after the wafer dicing process to inspect for defect that is observable prior to dicing and die defect resulted after dicing process. System comes with one load port to handle metal cassette for 8″ and 12″ wafer with 12″ and 16″ frame ring respectively. It’s equipped with high power microscope with 5 objective lenses for wafer front surface inspection and camera for wafer back side inspection. System consists of high accuracy motorized XY stage with Z focusing movement for indexing based on the wafer map. User friendly software comes with user defined defect codes for wafer mapping update and summary lot report for viewing after the inspection.
Specifications
- Single Wafer Autoloader for 200 and 300mm Wafer Size
- One Load Port for Standard Open Cassette
- High Power Microscope with Five Objectives (In the Range of 2.5x to 50x) Motorized Stage for XY Movements
- Decoding on Customer Wafer Map to QMC Mapping System
- Image Capturing System
- User-Defined Reject Code & Summary Lot Report after Inspection
- Built-in Barcode Scanner for Wafer Map Download/Upload Process from Server
Key Features
Load Port for Metal Cassette
Frame Loader
Programable XY Inspection Stage
High Power Microscope System
Wafer Backside Inspection
Load Port for Metal Cassette
- Equipped with 8” and 12” frame wafer cassette orientation guide.
- Equipped with 8” and 12” cassette presence detection.
- Equipped with 8” and 12” frame wafer protrusion sensor.
Frame Loader
- Equipped with pneumatic type gripper with 2 dowel pins to load/unload frame wafer from cassette.
- Equipped with anti-jamming sensor.
- Equipped with frame wafer present sensor for recovery purpose.
- Equipped with frame wafer alignment sensor.
Programable XY Inspection Stage
- Easy conversion between 8” and 12” frame wafer (Conversion time < 10mins).
- Programmable motorized XY stage and Z-focusing axis.
- Indexing accuracy of ±25 micron.
- Resolution of XY-stage at 1 micron.
- Resolution of Z-axis at 0.3 micron.
- Equipped with dowel guide pins and cylinder clamper to secure frame wafer.
- Sensor to detect wafer placement/present.
High Power Microscope System
- Equipped with Nikon L200N series high power microscope
- Optical inspection can be via microscope eyepiece for better image clarity and real-time image viewing via wide-screen TFT
- LCD monitor.
- Motorized revolving nosepiece that can store up to 5 objective lens with both bright and dark field capability.
- Nomarski DIC observation (Optional).
Wafer Backside Inspection
- Magnification: 4x optical/ 80x video.
- Motorized focusing Capability.
- 5MP color CCD Basler camera.
- Ultra-bright LED lighting with adjustable light intensity.