NEXIV VMF-K Series Video Measuring System

The NEXIV VMF-K Series combines two-dimensional measurement with high-accuracy height measurement in one video measuring system. It uses brightfield imaging for 2D measurement and confocal optics for full-field 3D height measurement.

As a result, users can measure dimensional and height characteristics within the same field of view. The system therefore reduces the need to move samples between separate measurement instruments.

NEXIV VMF-K Series for 2D and 3D Measurement

The NEXIV VMF-K Series uses two optical systems to support 2D and height measurement.

Brightfield imaging provides two-dimensional measurement. Meanwhile, confocal optics capture height information and create 3D images.

This combination supports measurement of semiconductor packages, probe cards, bonding wires, fine substrate patterns and other precision components.

For related QES semiconductor inspection and measurement solutions, visit QES Semiconductor Inspection and Handling Systems.

High-Speed Measurement for Semiconductor Applications

The VMF-K platform improves measurement throughput compared with the previous model. Under Nikon’s specified measurement conditions, the system achieves approximately 1.5 times higher measurement throughput.

In addition, Nikon added a 45× high-magnification model. This configuration supports fine semiconductor structures and can measure multi-dimensional details below 2 µm.

Therefore, the system suits measurement tasks that require both fine detail and measurement efficiency.

Confocal 3D Height Measurement

The VMF-K Series uses Nikon’s confocal optical system to capture height information across the field of view.

The system uses the Nipkow disk method to generate confocal images. Each pixel provides XYZ information, allowing users to measure height, step height, flatness and other three-dimensional features.

In addition, confocal measurement can help when brightfield imaging struggles with high-contrast surfaces or unstable light reflection.

Semiconductor Measurement Applications

The VMF-K Series supports several semiconductor measurement applications.

Probe Cards

The system can measure XY and Z coordinates of microscopic probe-card contact areas within the field of view. Furthermore, large measurement programs can support applications with very high numbers of measurement points.

Wafer-Level Packages

Users can measure bump positions, diameters and heights through full-field 3D height measurement.

Bonding Wires

The 3D image can identify the highest points of bonding wires within the field of view. In addition, the system provides height-profile information for wire-loop measurement.

Fine Bump and Substrate Patterns

The combination of brightfield imaging and confocal measurement supports fine bump and substrate pattern measurement.

H2: NEXIV VMF-K6561 for Panel-Level Packages

The NEXIV VMF-K6561 expands the VMF-K Series for large-format semiconductor packaging.

It features a 650 × 610 mm stage and can measure an entire 600 × 600 mm panel-level package in a single setup.

Nikon’s release information confirms that the VMF-K6561 builds on the established 2D and height measurement technologies of the VMF-K platform. Nikon also states that the model supports full-panel measurement of 600 × 600 mm panel-level packages.

Measurement Software and Automation

NEXIV AdvancedMeasure supports measurement-program creation, replay and evaluation.

The software supports both 2D measurement and 3D height measurement. In addition, the system provides Laser Auto Focus Retry, Search–Height Measurement and expanded measurement-code capacity. Measurement results can also be stored in CSV format.

Automatic detection can identify sample misalignment. The system can also detect and measure features such as bumps and bonding wires.

NEXIV VMF-K Series Models

The VMF-K3040 provides a general-purpose configuration. Meanwhile, the VMF-K6555 and VMF-K6561 provide larger stages for PCB and panel-level package applications.

NEXIV VMF-K Series Measurement Specifications

The system supports optical magnifications from 1.5× to 45×. The minimum readout reaches 0.01 µm. Confocal height measurement repeatability varies according to the selected optical configuration.

The available configurations provide different field-of-view and working-distance combinations. Therefore, users can select an optical configuration according to the required measurement feature and sample.

For the manufacturer’s latest information, refer to the official Nikon NEXIV VMF-K Series product page.