Post Die Attach Vision Inspection System – PDA100K

  • Precision inspection systems for post-die attach processes in semiconductor manufacturing.

Description

With elegant and innovative design, PDA100K is made for automated optical inspection system towards die on ceramic panels. The system comes with 2D inspection on die placement and cosmetics defects, as well as 3D inspection on stack height. Using simple yet effective loading/unloading module, ceramic panels are transferred onto/from the inspection stage with high smoothness and precision control. The combination of 2D & 3D laser profile ensures the optimal inspection accuracy covering all possible detections on the die. PDA100K comes with smart and user-friendly software for easy operation and fast recipe setup with user friendly GUI.

Specifications
  • Auto 2D Vision Inspection Tool for Ceramic Die Attach Panel
  • Die Height Measurement via Laser Profiler Module
  • Cassette Slot Mapping System for Cross-Slot Detection
  • Capable to Handle the Sample with Dimension of 100mm(Width) x 100mm(Length)
  • High Precision Stage Indexing Movement up to ±1µm
  • High Resolution 5MP Colour Camera.
  • Multiple Unit per Capture for Improvised UPH.
  • Laser Profiling Length up to 15mm
  • Programmable Recipe Control & Strip Mapping Capability

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