Post Wire Bond Inspection System – PWB2000

Inspection systems ensuring high-quality wire bonding in semiconductor manufacturing

Description

High resolution and speed of vision inspection system, PWB2000 is automated, reliable and effective solution for post die attach and post wire bond inspection. The system comes with the area scanning camera that capable to capture defects by using the 2D vision system. Integrated with programmable dual XY stage and on-the-fly scanning method, the system can accommodate multiple magazines at one time operation and eliminate the waiting time.

Specifications
  • Auto 2D Vision Inspection Tool for 3rd Optical Application
  • Multiple Magazine Loader & Dual Scanning Track Mechanism
  • Capable to Store Maximum up to 5 Magazines (90mm Width Each)
  • Capable to Handle the Maximum Dimension of Sample up to 100mm (Width) x 300mm (Length)
  • High Resolution of Camera Up to 8.9MP
  • Defect Classification based on 4 Vision Tools
  • Lighting Type of using Dome Light Ultra Bright for Stroboscope
  • On-the-Fly Vision Scanning with Stroboscopic Control
  • Programmable Recipe Control and Strip Mapping Capability

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Technology & Expertise Focus

✅ Cutting-Edge Precision: Industry-leading testing and measurement tools with advanced metrology and automation solutions.
✅ Comprehensive Equipment Range: From non-destructive testing (NDT) tools to automated optical inspection (AOI) systems, we cover all your needs.
✅ Industry Trusted: Serving top manufacturers in semiconductor, automotive, metal, and electronics industries.
✅ Global Support & Service: With a dedicated team of experts, we provide end-to-end testing solutions across multiple regions.