Taping & Detaping Machine – TS-PRO

  • The unique mechanism allows the tape to have suction applied and be pressurized so that the back tape can be applied without wire damage occurring to the installed lead frame.
  • The pre-tape method results in wire-bonding failure due to the tape, but the TS-PRO can be introduced to change the process order so that wire-bonding failure due to tape does not occur.

Description

The TS-PRO has the No.1 market share as a machine adopted by major Outsourced Semiconductor Assembly and Test (OSAT) companies, particularly in Taiwan, China and Japan.

Using our unique taping technology (patented), quality and cost issues regarding the QFN package can be improved, traditionally associated with the pre-tape method. The TS-PRO WIDE is also available with a frame width of 100 mm for HD.

Unique taping mechanism

The unique mechanism allows the tape to have suction applied and be pressurized so that the back tape can be applied without wire damage occurring to the installed lead frame.

Reduction of defects due to process changes

Tape is applied after plasma cleaning to reduce the amount of dust that adheres to the frame and to reduce resin leakage (flash).

The pre-tape method results in wire-bonding failure due to the tape, but the TS-PRO can be introduced to change the process order so that wire-bonding failure due to tape does not occur.

 

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