UV Irradiation Equipment

  • UV irradiation equipment for dicing tape. For wafers up to 300mm.
  • All parameters important for UV irradiation can be controlled in the recipe.
  • Settings can be quickly changed to process different wafer/frame sizes.
  • Longer-lasting UV lamp realized by TTS’s proprietary UV technology.
  • Other optional features are available.

Description

SPECIFICATIONS

Power

AC200-240V,Single Phase
Power Consumption3KVA[with UV]
Clean Air Pressure(CDA)0.5 – 0.6 MPa( Min Flow Rate:120NL/min)
Vacuum650 – 750mmHg( Min Flow Rate:60NL/min)
Nitrogen(For UV)0.2 – 0.4 MPa( Min Flow Rate:20NL/min)
Exhaust Duct Capacity1.0m3/min,10mmH20(100mm diameter SUS Flange duct connection)

 

System Arrangement

Dimension(WxDxHmm)1350×1250×1800
Net WeightAppx 500Kg

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