The MPT1000 is Chapman Instruments’ latest non-contact system, providing wafer thickness measurements. It can be used as a production tool for in-line quality inspection, a research and development tool for establishing standards, and compiling data for enhancing productivity. The MPT1000 utilizes a sophisticated non-contact measurement technology with a focused laser spot on the wafer surfaces. Users can measure structured taped wafers after backgrind or dicing. The powerful, user-friendly, Windows® based operational software can be programmed to provide automated wafer thickness maps, execute a series of measurements, or report the data offline for further analysis.