Contactless One-Point Wafer Thickness Gauge – MX 30x Series

  • The MX30x series are manual one-point┬áThickness gauges for silicon wafers.

Description

The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate is a set of capacitive distance sensors. The wafer will be moved or automatically between the plates and measured without any movement.

Applications

  • Incoming inspection of Wafers
  • R&D
  • Qualification of processes
  • In-process control for
    • Thickness (e.g. backend)
    • TTV
    • Warp, FPD
    • Stress

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