Contactless One-Point Wafer Thickness Gauge – MX 30x Series

  • The MX30x series are manual one-point┬áThickness gauges for silicon wafers.


The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate is a set of capacitive distance sensors. The wafer will be moved or automatically between the plates and measured without any movement.


  • Incoming inspection of Wafers
  • R&D
  • Qualification of processes
  • In-process control for
    • Thickness (e.g. backend)
    • TTV
    • Warp, FPD
    • Stress

You may also like…

Work with the best integrated solution provider

Subscribe Newsletter

2022 @ QES GROUP BERHAD (201401042911)