Fully-automatic Vacuum Laminator – 300mm

  • A vacuum laminator for wafers of 300mm. (optionally available:8inches)
  • Single and double cassette loading
  • Two cutting methods (including V-notch cutting): digital cutter blade method,Pre-Cur method
  • All parameters important for taping can be controlled in the recipe.
    Equipment can be configured with an ultimate vacuum at 100Pa.
  • Can be used with thinner wafers.(such as shaped or reworked wafers)
  • Other optional features are available.



PowerAC200-240V,Single Phase
Power Consumption3KVA
Clean Air Pressure(CDA)0.5 – 0.6 MPa( Min Flow Rate:120NL/min)
Vacuum650 – 750mmHg( Min Flow Rate:60NL/min)
Exhaust Duct Capacity5.0m3/min,40mmH20(100mm diameter SUS Flange duct connection)


System Arrangement

Net WeightAppx 500Kg

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