Fully-automatic Vacuum Laminator – 300mm

  • A vacuum laminator for wafers of 300mm. (optionally available:8inches)
  • Single and double cassette loading
  • Two cutting methods (including V-notch cutting): digital cutter blade method,Pre-Cur method
  • All parameters important for taping can be controlled in the recipe.
    Equipment can be configured with an ultimate vacuum at 100Pa.
  • Can be used with thinner wafers.(such as shaped or reworked wafers)
  • Other optional features are available.

Description

SPECIFICATIONS

PowerAC200-240V,Single Phase
Power Consumption3KVA
Clean Air Pressure(CDA)0.5 – 0.6 MPa( Min Flow Rate:120NL/min)
Vacuum650 – 750mmHg( Min Flow Rate:60NL/min)
Exhaust Duct Capacity5.0m3/min,40mmH20(100mm diameter SUS Flange duct connection)

 

System Arrangement

Dimension(WxDxHmm)1250×1390×1850
Net WeightAppx 500Kg

Work with the best integrated solution provider

About Company

Subscribe Newsletter

2021 @ QES GROUP OF COMPANIES (201401042911)