Description
The PPI3300 is an ideal solution for detecting defects on 8-inch and 12-inch patterned wafer surfaces such as scratches, ink dot smear, probe marks, water marks, and die edge cracks. High Speed CMOS camera with resolution of 26.1MP & CoaXPress interface is used in the system. The combination of 5120 x 5120 high resolution, high speed at 90 FPS and global shutter create a new standard for the inspection application. The CF objective was used to extend the working distance while maintaining a high NA, resulting in images that are crisp and clear, with high contrast and resolution. The micro wafer station has been integrated with a rotary table and an anti-vibration platform to provide accurate and high throughput inspection. Auto loading, wafer ID reader for OCR and 2D matrix code reading, and auto defect inspection are all part of the standard system configuration.
- Automated 2D Vision Inspection for Wafer
- 26MP High Resolution Camera
- Bright Field Inspection with Nikon High Magnification Microscope
- Laser Auto Focus Module
- High Accuracy Motorized XY Stage using Linear Motor
- Vibration Isolation Platform
- Hirata 3-Axis ATM Single Arm Robot
- Hirata Wafer Pre-aligner
- IOSS WID120 OCR Reader
- HEPA / ULPA Filter (Optional)
- TCP-IP and RS232 Data Interface
