Description
Chip Failure Analysis AT room temperature and high and low temperature rf device Failure analysis MATERIAL/device IV/CV characteristic test and Failure analysis Chip internal circuit/electrode /PAD test IC/ panel internal circuit modification/layer removal.
- Large handle drive, no clearance movement.
- Ergonomic design, convenient and comfortable to operate.
- Multi-band laser application, fast switching and accurate cutting.
- Compatible with high power metallographic microscope for fine adjustment and movement.
- No backtrip difference design, accurate positioning.
- The air cooling structure is compact and requires no maintenance.
- High precision system, laser machining accuracy up to 1*1um.
- Leading internal anti – shock system device, more stable operation.
| Model FA series | |||
| Specification | |||
| Model | FA-8 | FA-8-SC | |
| Dimension | L: 960mm*W: 850mm*H: 1500mm | L: 880mm*W: 860mm*H: 1550mm | |
| Weight (about) | 260KG | 280KG | |
| Electricity Demand | 220VC, 50~60Hz | ||
| Chuck | Size & Rotation angle | 8″, 360° Rotation | |
| X-Y travel range | 8″ * 8″ | ||
| Moving resolution | 1μm | ||
| Sample fixed mode | Vacuum adsorption | Vacuum adsorption | |
| Temperature control range | – | – 80~200℃ | |
| Quick pull out | – | yes | |
| Electrical design | Chuck Surface is Electrical Floating with Banana plug adapter, can be used as a backside electrode. | ||
| Platen | Specification | U shape Platen, 10 micropositioners available | O shape Platen, 12 micropositioners available |
| Travel & adjustment mode | Platen can be quickly lifted up and down 6mm with automatic locking function,Platen can be fine tuned up and down 25mm precisely with 1μm resolution | ||
| Microscope | Travel range | X-Y: 2″ * 2″, Z: 50.8mm | X-Y: 1″ * 1″, Z: 50.8mm |
| Resolution | 1μm | ||
| Magnification | 20 ~ 4000X | ||
| Operation of lens switching | Fast tilting | Pneumatic lifting | |
| CCD pixels | 50W (Analog) / 200W (Digital) / 500W (Digital) | ||
| Laser | Wavelength | Wavelength selectable: 1064/532/355/266nm | |
| Output power | 0~2.2mJ/pulse | ||
| Micromachining capability | Machinable material: Cr / Al / ITO / Ni / TFT / RGB / Poly Silicon / Mo / SiN / CF internal impurity etc. | ||
| Precision | Minimum Machinable size is 1*1μm (when using 100X lens) | ||
| Cooling mode | Air-cooled laser or Water cooled laser | ||
| Micropositioner | X-Y-Z moving range | 12mm-12mm-12mm / 8mm-8mm-8mm | |
| Mechanical resolution | 2μm / 0.7μm / 0.1μm | ||
| Current leakage accuracy | Coaxial 1pA/V @ 25 ℃; Three shaft 100fA/V @ 25 ℃; Triaxial 10pA@3kv @25°C， Test conditions: dry environment for grounding shield (air dew point lower than – 40 ° C) | ||
| Cable connectors | Banana head / Crocodile clip / Coaxial / Triaxial | ||
| Optional Accessories | Chuck fast pull-out mechanism | ||
| Hot spot detection by liquid crystal package | |||
| High voltage / high current test suite | |||
| Hot chuck | |||
| Shielding box | |||
| Special adapter | |||
| Vibration free table | |||
| Gold-plated chuck | |||
| Coaxial / Triaxial chuck | |||
| Chuck Z quickly lifting and lowering and fine adjustment selection | |||
| Light intensity / wavelength test | |||
| RF test accessories | |||
| Active probe | |||
| Low current / Capacitance test | |||
| Fixture for Fibre optic coupler test | |||
| Fixture of Packaged IC test accessory | |||
| Fixture of PCB test accessory | |||
| Special Custom design | |||
| Application | Failure analysis of IC/LCD/OLED in varing temperature environment | ||
| Characteristic | |||
| Failure analysis | Comfortable large handle, Driver Screws: Zero back lash | ||
| Chip hot spot detection by liquid crystal | Internal circuit/ electrode/ PAD probe | ||
| Laser cut ,ablation and selectively remove | RF Devices characteristic | ||
| Applicable to the internal line modification / repair of the IC/LCD panel | IV / CV characteristic test and failure analysis of Materials / Devices | ||
| Up to 12 inch wafer testing | Laser minimum machining size 1*1μm | ||
