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Fully-Automatic Wafer Tape Laminator – 300mm
- A tape laminator for wafers up to 300mm(optionally available:8inches)
- Single and double cassette loading
- Two cutting methods (V-notch cutting): digital cutter blade method and class 4 CO2 laser method.
- All parameters important for taping can be controlled in the recipe.
- Can be used with thinner wafers.(such as shaped or reworked wafers)
- Other optional features are available.