XT H Series Microfocus X-ray CT System

The XT H Series provides high-resolution microfocus X-ray CT inspection for components and assemblies. The platform supports non-destructive inspection for research and development, failure analysis and production quality control.

In addition, the system provides several CT scanning technologies. Therefore, users can select a suitable approach for different component geometries, materials and inspection requirements.

For related QES inspection and measurement equipment, visit QES Inspection, Test & Measurement Equipment.

XT H Series for High-Resolution CT Inspection

The XT H Series combines microfocus X-ray technology with computed tomography. As a result, engineers can examine internal structures without destructive sectioning.

The system supports inspection of components ranging from small electronic and plastic parts to larger industrial components.

This capability supports failure analysis, product development and production quality investigations.

X.Tend Helical CT for Tall Components

X.Tend Helical CT provides continuous scanning for tall components.

With conventional CT, engineers may need several scans and then stitch the datasets together. In contrast, helical CT can scan the component continuously.

The technique can also position the sample closer to the X-ray source. As a result, geometric magnification can increase and support higher-resolution inspection.

225 kV Rotating.Target 2.0

The XT H platform can use Nikon’s 225 kV Rotating.Target 2.0 technology.

The system supports continuous operation up to 450 W. Therefore, users can balance resolution and acquisition speed according to the inspection requirement.

For example, higher X-ray power can support faster data acquisition when the application requires greater throughput.

Flexible CT Scanning Technologies

The XT H Series supports several CT scanning techniques.

• Offset.CT – Offset.CT supports inspection of components that exceed the detector’s standard field of view. It can also position the sample closer to the X-ray source to improve geometric magnification.
• Half.Turn CT – Half.Turn CT uses optimised reconstruction methods to reduce the amount of data required during acquisition. Therefore, the technique can help reduce CT acquisition time.
• Dual.Material CT – Dual.Material CT supports inspection of samples that contain different materials. The reconstruction approach can help reduce artefacts associated with high-density materials.
• Auto.Filament Control – Auto.Filament Control manages the X-ray source filament automatically.

As a result, the system can support longer filament lifetime without requiring manual filament management. This approach can reduce replacement frequency and support system availability.

Metrology-Grade CT Measurement

The XT H platform includes the MCT225 configuration for high-accuracy CT measurement.

The MCT225 supports dimensional measurement applications and maximum permissible error verification according to VDI/VDE 2630.

Therefore, the system can support both internal inspection and quantitative dimensional measurement.

QES also provides related semiconductor inspection and metrology equipment through its semiconductor portfolio. QES Semiconductor FEOL and BEOL Inspection Systems

Applications of the XT H Series

The XT H Series supports applications across research, engineering and manufacturing.

Typical applications include:

• Failure analysis
• Research and development
• Production quality control
• Electronics inspection
• Plastic component inspection
• Aluminium casting inspection
• Automotive component inspection
• Aerospace component inspection
• Additive manufacturing
• Dimensional CT measurement

For example, engineers can use CT data to investigate internal structures and defects without damaging the sample. As a result, the same component can continue through further analysis or development work.

XT H Series Configurations

The XT H platform provides configurations for different inspection requirements.

The XT H225 targets small to medium-sized parts.

The XT H225 ST 2x provides a flexible configuration for a wider range of applications.

The MCT225 focuses on high-accuracy X-ray CT metrology.

Therefore, users should consider component size, material density, required resolution, acquisition speed and measurement requirements when selecting a configuration.

XT H Series X-ray CT Applications

The system supports non-destructive inspection across multiple industries. In particular, engineers can use microfocus CT for internal inspection, failure analysis and dimensional evaluation.

The XT H Series can therefore complement other QES inspection technologies when a three-dimensional view of internal component structures is required.

For the manufacturer’s latest information, refer to the official Nikon XT H Series product page.